The applications of Cu substrate in liquid metal cooling systems

Publication date: 15 September 2018
Source:Materials Letters, Volume 227
Author(s): Tomasz Gancarz, Katarzyna Berent
Advances in electronics and nuclear energy have led to devices producing greater heat and therefore requiring more efficient cooling systems. The proposed liquid metal based on eutectic Ga-Sn-Zn meets such expectations. First, however, the materials which are used for storage and mostly applied in electronics, such as Cu, should be examined. The investigated liquid/Cu substrate couples were cross-sectioned and subjected to scanning electron microscopy to observe interfacial microstructure changes. The created intermetallic Cu-Ga phase layer at the liquid/Cu substrate interface was identified by x-ray diffraction analysis, and the kinetics of the formation and growth of the IMC layer were determined.



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